Underwater ROV System
Pressure-resistant enclosures and structural mounts designed for submerged electromechanical systems.

3D Model
Overview
Engineered pressure-tolerant housings and mechanical mounts for underwater electronics. Focus on seals, thermal pathways, and structural reinforcement for long-duration underwater deployment.
The Problem
Sealing electronics while providing thermal management required different sealing strategies and material choices. The enclosure needed to survive sustained pressure at operational depth while remaining serviceable.
My Approach
Iterated on o-ring geometries, housing wall thickness, and performed finite-element analysis and pressure chamber testing. Balanced sealing integrity with thermal conduction paths for heat dissipation from enclosed electronics.
Key Results
Achieved a rugged enclosure rated for operational depth with improved manufacturability and reduced maintenance turnaround during service cycles.
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