Compact assemblies and precision mechanical design to integrate IMUs, magnetometers and PCBs with tight thermal and structural constraints.
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May 2023 - Aug 2023
Skills Used
CAD, GD&T, thermal & structural FEA, sensor packaging
Deliverables
Validated IMU enclosure, tolerance stack-ups, test plans
Tags
Robotics | Wearables | Thermal management
Overview
Designed compact assemblies to house multiple sensing elements and PCBs with a focus on thermal management, structural integrity, and manufacturability. I led the CAD development, tolerance stack-ups, and performed FEA validation to ensure repeatable performance over a wide temperature range.
Role
Mechanical design lead - concept to production transfer, FEA and test validation.
Problem & Solution
The challenge was maintaining sensor alignment while keeping the assembly small and thermally stable. Solution: introduced compliant mounting features, thermal conduction paths, and optimized wall thicknesses for stiffness-to-weight balance.
Impact
Delivered a robust assembly that passed thermal cycling and vibration tests and reduced rework during assembly by improving accessibility for the PCB and connector interfaces.
Build Gallery
